Glass chip for observing underfill entrapment voids.
Glass chip for observing underfill entrapment voids.
Underfill Encapsulation Void Observation Glass Chip ■Wafer Size: 5-inch Wafer ■Base Chip Size: 5.02mm × 5.02mm ■Pad Pitch: 200μm ■Number of Pads: 484 Bumps ■Compatible Bump Processes: Eutectic Solder / Lead-Free Solder ■Compatible Substrates: JKIT Type1 (SIDE A) / JKIT Type5 ■Base Material: Natural Quartz Glass ■Options: Bump Mounting / Dicing Processing ■Main Applications: Material Development, Process Startup/Verification, Promotional Data Acquisition, etc.
- Company：ウェル
- Price：Other
